Inkjet print head clean-in-place systems and methods

ABSTRACT

The disclosure relates to systems and methods for direct clean-in-place (CIP) of inkjet print heads. More particularly, the disclosure relates to systems and methods for facilitating CIP of inkjet print heads by selectably alternating the position of a mask disposed between the print head and a printing surface, between printing position, cleaning position and/or purging positions.

BACKGROUND

The disclosure is directed to systems and methods for directclean-in-place (CIP) of inkjet print heads. Specifically, the disclosureis directed to systems and methods allowing CIP of print heads byselectably alternating the position of a mask between printing, cleaningand purging positions.

Inkjet printing heads require periodic cleaning of printing nozzles toremove buildup (solid sediments) on the nozzles, remove air bubbles, andotherwise maintain printing quality. Cleaning the printing head is asignificant part of the inkjet printing process, for example in someindustrial settings the printing head is cleaned as often as every twominutes. The frequency of cleaning depends on the specific applicationfor which the printing head is being used. Typically, cleaning can alsobe done by removing the print head to one side of the printer for easyaccess and manually cleaning the head. These methods are time consumingand inefficient.

An orifice plate, can be located on the printing side (lower surface) ofthe printing head, providing access for the nozzles to print, whilepotentially also providing protection for the printing head. Jetted inkfrom each nozzle can exits the orifice for printing. During periodiccleaning and/or after purging, the orifice surface can be cleaned toremove buildup, purged liquid, and enable proper jetting of the printingliquid from the nozzles (via the orifices). In order to preserve thesmoothness and high interfacial tension between the printing side andthe jetted ink (non-wetting characteristic) and the orifice surface,care must be taken in performing wiping.

Typically, removing content without contact to the orifice plate can bedone using vacuum where a vacuum ‘head’ is moved across the orificeplate. The vacuum head can be maneuvered sufficiently close to allow thevacuum induced suction, to remove the jetted liquid from the orificeplate. Because the vacuum head does not contact the orifice plate,efficiency of the orifice plate cleaning is low. Typically, where aninjection bath is present, the print head move to one side of theprinter to purge the ink, which is time consuming and otherwiseinefficient. Other disadvantages to conventional vacuum removal includecost, printing speed, reliability, and quality.

Moreover, when the ink contains volatile components, the ink at a tip ofa nozzle may lose those components, resulting in certain circumstancesin the remaining ingredients of the ink forming a semi-solid skin at thenozzle tip. The semi-solid skin, or buildup of solid sediments, caninterfere with the jetting of ink from the nozzles, reducing the qualityor even disabling jetting of ink from one or more nozzles. As the nozzletips are aligned with orifices in an orifice plate, sediment buildup canalso be on the orifices and/or orifice plate.

There is therefore a need for a system for cleaning an orifice plate,with increased efficiency over conventional techniques, and preventingsediment buildup.

SUMMARY

Disclosed, in various embodiments, are systems and methods for directclean-in-place (CIP) of inkjet print heads. Also disclosed, areembodiments of systems and methods allowing CIP of print heads byselectably alternating the position of a mask between printing, cleaningand purging positions.

In an embodiment provided herein is a cleaning-in-place system forinkjet printing heads comprising: a mask having an upper surface and alower surface, the mask defining: a cleaning window; a printing slit;and a purge well recessed into the upper surface of the mark; a printhead having a distal end, a proximal end, a longitudinal axis, and atransverse axis the distal end having lower surface defining at leastone orifice; a three (3) dimension alignment assembly, operably coupledto the print head and the mask; and a bracket, operably coupled to thealignment assembly, wherein the mask is configured to selectably alignthe cleaning window, the printing slit, or the purge well with theprinting head's at least one orifice.

In another embodiment, provided herein is a method of cleaning-in-placean inkjet print head, comprising providing a clean-in-place systemcomprising: a mask having an upper surface and a lower surface, the maskdefining a printing slit disposed between a cleaning window and a purgewell recessed into the upper surface of the mask; and a print headhaving a distal end, a proximal end, a longitudinal axis, and atransverse axis the distal end having lower surface defining at leastone orifice; selectably aligning the cleaning window or the purge wellwith the printing head's at least one orifice; cleaning or purging theprinting head's one orifice; and aligning the at least one orifice withthe printing slit.

These and other features of the methods, and systems forcleaning-in-place system of inkjet printing head(s), will becomeapparent from the following detailed description when read inconjunction with the figures and examples, which are exemplary, notlimiting.

BRIEF DESCRIPTION OF THE FIGURES

For a better understanding of the methods, and systems forcleaning-in-place system of inkjet printing head(s), with regard to theembodiments thereof, reference is made to the accompanying examples andfigures, in which:

FIG. 1 illustrates an exploded isometric view of an embodiment of thesystem for cleaning-in-place system of inkjet printing head(s);

FIG. 2, illustrates a top left isometric view of the assembledembodiment illustrated in FIG. 1;

FIG. 3, illustrates a bottom left isometric view thereof, printing headaligned with printing slit;

FIG. 4 illustrates a bottom left isometric view thereof, printing headaligned with cleaning window;

FIG. 5 illustrates a schematic Y-Z cross section view of the maskpositioning during cleaning operation;

FIG. 6, illustrates a schematic Y-Z cross section view of the maskpositioning during purging operation through the printing slit;

FIG. 7, illustrates a schematic Y-Z cross section view of the maskpositioning during purging operation to the purge well and

FIG. 8 illustrates a schematic X-Y cross section view of an embodimentof the mask.

DETAILED DESCRIPTION

Provided herein are embodiments of systems and methods forcleaning-in-place of inkjet print head(s).

In an embodiment, provided herein is a system capable of regulating thetemperature of inkjet printing heads while allowing the printing headsto be cleaned in place (CIP, in other words, without disassembling anyof the components of the system, or otherwise changing the position ofthe printing head relative to the printed surface). The system comprisesan insulating mask disposed between the printing head(s) and theprinting surface, which can be, for example, a substrate, a printedcircuit board, a paper and the like. The printed surface can be held ata predetermined temperature, while the print head(s), using theinsulating mask, can be maintained at the same or different temperature.

The mask can include one or more printing slits corresponding to one ormore nozzles (or printing head(s)). The slits are positioned and sizedto allow jetted ink from the nozzles to pass through the mask (via thecorresponding slit) to the printed surface. For example, row of nozzleson the orifice plate can be offset from the edge of the slit, to shieldthe nozzles from fumes potentially emitted from the printed surface andexcessive heat emitted from the printing substrate. The mask plate canfurther define a cleaning window, providing easy access for the printinghead(s). The cleaning window is substantially larger than the printingslit and be configured to provide access to the entire lower surface ofthe print head(s). In addition, the mask can have an upper surfacedefining a purge well recessed into the surface. The spatial arrangementof the printing slit, the cleaning (e.g., wiping) window and the purgewell can be interchangeable. For example, and in an embodiment, theprinting slit is disposed between the cleaning window and purge well. Inthis configuration, the mask can be translated a first distance fromalignment of the orifice(s) (e.g., on an orifice plate disposed on thelower surface of the print head(s)) above the printing slit, to bealigned over the purge well, or, translated in the opposite directionsuch that the orifice(s) is(/are) aligned over the cleaning window.

A suction tube can be either static (fixed in place) or mobile(selectably maneuvered) and be positioned in fluid communication withthe purge well. The term “fluid communication” refers to any area, astructure, or communication that allows for fluid communication betweenat least two fluid retainment regions, for example, a tube, duct,conduit or the like connecting two regions. One or more fluidcommunication can be configured or adapted to provide for example,vacuum driven flow, electrokinetic driven flow, control the rate andtiming of fluid flow by varying the dimensions of the fluidcommunication passageway, rate of circulation or a combinationcomprising one or more of the foregoing. In an embodiment, the term“selectably” means that the subsequent operation can be done upon demandby a user without affecting other operations and/or elements. The inkand other components (e.g., build up residue, solid sediment and thelike) suctioned off using the system described herein can be transportedto a recycling system, modified and returned to the print head inkreservoir. The recycling sub-system may comprise various components, forexample filters, adsorbing elements, manifolds, addition of varioussolvents and additives and the like. Generally, the term “recycling”refers to a sub-system used to reprocess the purged content of the purgewell to a condition where it can be used effectively in the printingoperation carried out.

Accordingly, provided herein is a cleaning-in-place system for inkjetprinting heads comprising: a mask having an upper surface and a lowersurface, the mask defining: a cleaning window; a printing slit; and apurge well recessed into the upper surface of the mark; a print headhaving a distal end, a proximal end, a longitudinal axis, and atransverse axis the distal end having lower surface defining at leastone orifice; a three (3) dimension alignment assembly, operably coupledto the print head and the mask; and a bracket, operably coupled to thealignment assembly, wherein the mask is configured to selectably alignthe cleaning window, the printing slit, or the purge well with theprinting head's at least one orifice.

The terms “first,” “second,” and the like, when used herein do notdenote any order, quantity, or importance, but rather are used to denoteone element from another. The terms “a”, “an” and “the” herein do notdenote a limitation of quantity, and are to be construed to cover boththe singular and the plural, unless otherwise indicated herein orclearly contradicted by context. The suffix “(s)” as used herein isintended to include both the singular and the plural of the term that itmodifies, thereby including one or more of that term (e.g., the head(s)includes one or more head). Reference throughout the specification to“one embodiment”, “another embodiment”, “an embodiment”, and so forth,means that a particular element (e.g., feature, structure, and/orcharacteristic) described in connection with the embodiment is includedin at least one embodiment described herein, and may or may not bepresent in other embodiments. In addition, it is to be understood thatthe described elements may be combined in any suitable manner in thevarious embodiments.

In addition, for the purposes of the present disclosure, directional orpositional terms such as “top”, “bottom”, “upper,” “lower,” “side,”“front,” “frontal,” “forward,” “rear,” “rearward,” “back,” “trailing,”“above,” “below,” “left,” “right,” “radial,” “vertical,” “upward,”“downward,” “outer,” “inner,” “exterior,” “interior,” “intermediate,”etc., are merely used for convenience in describing the variousembodiments of the present disclosure.

The term “coupled”, including its various forms such as “operablycoupled”, “coupling” or “coupleable”, refers to and comprises any director indirect, structural coupling, connection or attachment, oradaptation or capability for such a direct or indirect structural oroperational coupling, connection or attachment, including integrallyformed components and components which are coupled via or throughanother component or by the forming process (e.g., an electromagneticfield). Indirect coupling may involve coupling through an intermediarymember or adhesive, or abutting and otherwise resting against, whetherfrictionally (e.g., against a wall) or by separate means without anyphysical connection.

The mask, or mask plate used in the systems and methods forcleaning-in-place described herein can be jacketed. In other words, themask plate can comprise various geometries of conduits embedded withinthe mask plate, configured to convey cooling and/or heating medium. Themedium can be, for example, gaseous or liquid and be attached to acirculating pump and be further in electric communication with at leastone sensor (e.g., thermometer) and a processor, configured to maintain apredetermined temperature or a programmable temperature profilethroughout the printing process and the CIP process. For example, thesystem can comprise sensor array at various locations, with temperaturedata feedback to the processor, which, in turn, will control thecooling/heating medium (e.g., silicone oil) temperature and/orcirculation rate. Temperature sensors can be positioned, for example, onthe printed surface, the print head(s), the orifice plate(s), the purgewell, inlet port, outlet port or a combination of location comprisingone or more of the foregoing. Likewise, the mask can comprise variousheating elements embedded within the mask plate and the liquid used is acooling liquid whereby temperature is regulated and modulated bybalancing the heating and cooling of the mask plate.

Other sensors can be incorporated into the system, for example, image(visual) sensors (e.g., CMOS, CCD, for example to monitor ink color,drop shape/volume), microflow (or flow) sensors (e.g., EM based,Resonant feedback based, Pitot-based) viscosity sensors, timing sensors,conductivity sensors, or an array comprising one or more of theforegoing. The sensors, including the temperature sensors can providedata to a processor comprising memory having thereon computer-readablemedia with a set of executable instruction enabling the processor, beingin electronic communication with a driver, to automatically (in otherwords, without user intervention) change the position of the cleaningwindow, printing slit and purge well in the mask, relative to the printhead. The processor may also determine whether purging ink from theprint head will be jetted through the printing slit (for example, duringinitial operation), or purged into the purge well and recycled back toan ink reservoir in fluid communication with the print head.

The processor can further have a memory module with computer readablemedia stored thereon, comprising a set of instructions thereonconfigured to carry out the CIP methods described herein, providetemperature controls, and the like.

The mask plate can be operably coupled to a driver. The driver can be,for example, a servo motor or any suitable driver, such as an electricmotor, a pneumatic motor and/or any other suitable electrical,mechanical, magnetic or other motor or driver that can apply a torqueforce upon shaft and selectably cause the mask to translate along anaxis relative to the print head(s). The driver can be coupled to themask plate via rail(s) coupled to the mask plate and disposed along theedges of the mask plate.

The three dimensional alignment assembly can be configured to providethe printing head(s) with at least two degrees of freedom in Cartesiancoordinates system and one degree of freedom in spherical coordinatesystem. The assembly can comprise a base frame having a front end and aback end; a side-to-side (STS) aligning frame, operably coupled to thebase frame; and a front-to-back (FTB) aligning frame, operably coupledto the side-to-side aligning frame. The STS alignment frame (in otherwords, moving for example, in parallel with the printing direction) canhave a front end with detents configured to operably couple to at leastone adjustment box disposed on the front end of the base frame. Thebase-frame adjustment box can have means for translating the STS frame apredetermined distance in each direction. For example, the base-frameadjustment box can have a detent-engaging member, coupled to a beveledgear, which in turn is coupled to an adjustment screw or knob. The STSalignment frame can translate, for example, a distance of between about0.001 mm and about 10.0 mm. Other configurations are possible andcontemplated for the adjustment box and its coupling to the STSalignment frame detent.

The STS alignment frame can likewise comprise an adjustment boxconfigured to operably couple to a detent disposed on the sides of thefront-to-back alignment frame (FTB, or translation of the print head(s)in a direction perpendicular to the printing direction). The STSalignment frame adjustment box can be configured to affect thetransverse (to the STS alignment direction) translation of between about0.001 mm and 10.0 mm. The frames can be nested (one within the other),with the printing head centrally nested. Likewise, the print head(s) canhave a distal end with an alignment tab, configured to modulate roll (asopposed to pitch and yaw) of the print head relative to the transverseaxis, the alignment tab can operably couple to the FTB aligning frameand be engaged in adjustment box disposed on the FTB alignment frame.Adjustment knobs can be disposed on the printing head(s)′ and operablycouple to the adjustment box disposed on the FTB alignment frame. Theterm “engage” and various forms thereof, when used with reference toretention of a member (e.g., the detent), refer to the application ofany forces that tend to hold two components together against inadvertentor undesired separating forces (e.g., such as may be introduced duringuse of either component). It is to be understood, however, thatengagement does not in all cases require an interlocking connection thatis maintained against every conceivable type or magnitude of separatingforce. Also, “engaging element” or “engaging member” refers to one or aplurality of coupled components, at least one of which is configured forreleasably engaging a tab or detent. For example, the adjustment box canbe considered an engaging element.

The lower surface of the print head (e.g., the printing side) cancomprise an orifice plate, providing access for the nozzles, while alsoproviding protection for the printing head, among other features. Thenozzles can interface with the orifice surface via, for example,“cells”, with the jetting-end of each nozzle having a cell thatsurrounds the nozzle. The opening of the cell to the orifice surfacedefines an orifice, whereby jetted ink from each nozzle exits theorifice for printing. The lower surface of the print head used with thesystems and methods for CIP of inkjet print head(s) provided herein, candefine a plurality of orifices arranged in a matrix having M columns byN rows.

In an embodiment, the systems for CIP of inkjet print head(s) providedherein, are used in the methods provided. Accordingly, provided hereinis a method of cleaning-in-place an inkjet print head, comprising:providing a clean-in-place system comprising: a mask having an uppersurface and a lower surface, the mask defining a printing slit disposedbetween a cleaning window and a purge well recessed into the uppersurface of the mask; and a print head having a distal end, a proximalend, a longitudinal axis, and a transverse axis the distal end havinglower surface defining at least one orifice; selectably aligning thecleaning window or the purge well with the printing head's at least oneorifice; cleaning or purging the printing head's one orifice; andaligning the at least one orifice with the printing slit.

The methods of cleaning-in-place an inkjet print head described herein,can also comprise aligning the printing head's at least one orifice withthe purge well; purging a content of the printing head through the atleast one orifice into the purge well; and using the vacuum source,suctioning the content of the purge well, and for example, recycling thesuctioned content back to the print head(s) reservoir. As indicated, thesystem can comprise various temperature systems. Accordingly, themethods of cleaning-in-place an inkjet print head described herein, canalso comprise a step of modulating the temperature of the mask using airor liquid.

The term “comprising” and its derivatives, as used herein, are intendedto be open ended terms that specify the presence of the stated features,elements, components, groups, integers, and/or steps, but do not excludethe presence of other unstated features, elements, components, groups,integers and/or steps. The foregoing also applies to words havingsimilar meanings such as the terms, “including”, “having” and theirderivatives.

All ranges disclosed herein are inclusive of the endpoints, and theendpoints are independently combinable with each other. Furthermore, theterms “first,” “second,” and the like, herein do not denote any order,quantity, or importance, but rather are used to denote one element fromanother.

Likewise, the term “about” means that amounts, sizes, formulations,parameters, and other quantities and characteristics are not and neednot be exact, but may be approximate and/or larger or smaller, asdesired, reflecting tolerances, conversion factors, rounding off,measurement error and the like, and other factors known to those ofskill in the art. In general, an amount, size, formulation, parameter orother quantity or characteristic is “about” or “approximate” whether ornot expressly stated to be such.

A more complete understanding of the components, processes, assemblies,and devices disclosed herein can be obtained by reference to theaccompanying drawings. These figures (also referred to herein as “FIG.”)are merely schematic representations (e.g., illustrations) based onconvenience and the ease of demonstrating the present disclosure, andare, therefore, not intended to indicate relative size and dimensions ofthe devices or components thereof and/or to define or limit the scope ofthe exemplary embodiments. Although specific terms are used in thefollowing description for the sake of clarity, these terms are intendedto refer only to the particular structure of the embodiments selectedfor illustration in the drawings, and are not intended to define orlimit the scope of the disclosure. In the drawings and the followingdescription below, it is to be understood that like numeric designationsrefer to components of like function.

Turning now to FIG. 1, illustrating an isometric exploded view of anembodiment of the CIP system described herein. As illustrated, system 10can comprise mask 100 having upper surface 101 and lower surface 110.Mask 100 can define cleaning window 103, printing slit 104 and havepurge well recessed into upper surface 101 of the mask. System 10,further comprises at least one print head 500 having distal end 502,proximal end 505, longitudinal axis X_(l), and transverse axis X_(t).Distal end 502 can have lower surface 510 (or an orifice plate) definingat least one orifice 511 (not shown). System 10, can also comprise three(3) dimension alignment assembly (200-400), operably coupled to printhead 500 and mask 100. As illustrated, system 10 can comprise bracket600, operably coupled to the alignment assembly (200-400), wherein mask100 can be configured to selectably align cleaning window 103, printingslit 104, or purge well 105 (see e.g., FIG. 5) with printing head's 500at least one orifice 511.

Further, and as illustrated in FIGS. 1-2, three dimensional alignmentassembly (200-400) can be configured to provide printing head(s) 500with at least two degrees of freedom in Cartesian coordinates system andone degree of freedom in spherical coordinate system. Assembly 200-400can comprise flanged base frame 200 having a front end 202 and a backend (not shown). Also illustrated, is side-to-side (STS) aligning frame300, operably coupled to base frame 200 and a front-to-back (FTB)aligning frame 400, operably coupled to side-to-side aligning frame 300.STS alignment frame 300 (in other words, moving in parallel with theprinting direction) can have front end 302 with detents 303 configuredto operably couple to at least one adjustment box 203 disposed on frontend 202 of base frame 200. Flanged base-frame 200 adjustment box 203 canhave means for translating STS alignment frame 300 a predetermineddistance in each axial direction. For example, base-frame 200 adjustmentbox 203 can have detent 303 engaging member (not shown), coupled to abeveled gear, which in turn can be coupled to an adjustment screw 213 orknob. STS alignment frame 300 can translate, for example, a distance ofbetween about 0.001 mm and about 10.0 mm. Other configurations arepossible and contemplated for adjustment box 203 and its coupling to STSalignment frame 300 detent 303.

In addition, as shown in FIGS. 1 and 2, base frame 200 and alignmentframes 300 and 400 frames can be nested (see e.g., FIG. 2) (one withinthe other), with printing head 500 centrally nested. Likewise, distalend 502 of print head 500 can have alignment tab 503, configured tomodulate roll (as opposed to pitch and yaw) of print head 500 relativeto transverse axis X_(t) (see e.g., FIG. 1)., and Alignment tab 503 canoperably couple to FTB aligning frame 400 and be engaged in adjustmentbox 404 disposed on FTB alignment frame 400. The roll affected byadjustment box 404 can be between about 0.1 radian and about 2.0 rad.Adjustment knobs 513, 514 can be disposed on distal end 502 of printinghead 500 and operably couple to adjustment box 404 disposed on FTBalignment frame 400. As illustrated in FIG. 1, STS alignment frame 300,can have frame 301 with lateral wall 301 defining opening 304,configured to receive and engage alignment protrusion 403 extending fromFTB alignment frame 400. Again, alignment box 404 can be operablycoupled to alignment screw 405 (see e.g., FIG. 2) which, when turned orotherwise manipulated (e.g., pressure, pulling or bending), can affecttranslation of FTB alignment frame 400.

As also shown in FIG. 1, system 10, can comprise bracket 600, havingfirst side wall member 601, second side wall member 602, anteriortransverse member 603, and posterior transverse member 604. First andsecond side walls 601, 602 can have inferior end 610, 620 configured tooperably couple to flanged base frame's 200 lateral walls 201 above baseframe 200 flanged portion.

Turning now to FIG. 3, illustrating system 10 in a lower isometric viewduring printing stage. As illustrated, mask 100 is configured withprinting slit 104 defined in lower surface 110, disposed in betweencleaning window 103 (also defined in lower surface 110) and purge well105 (see e.g., FIG. 5) defined in mask 100, upper surface 101 (notshown, see e.g., FIGS. 1, 6). As illustrated, at least one orifice 511in lower surface 510 of print head 500, is aligned with printing slit104, allowing print head 500 to jet ink onto the printed surface. Theterm “ink” refers in an embodiment, in general to a material used forprinting, and can include, but is not limited to homogeneous andnon-homogenous materials, for example a carrier liquid containing metalparticles to be deposited via the printing process or other jettedsolutions, suspensions emulsions, gels or combination comprising one ormore of the foregoing.

Turning to FIG. 4, illustrating system 10 in a lower isometric viewduring cleaning stage. As illustrated, mask 100 configured with printingslit 104 defined in lower surface 110, disposed in between cleaningwindow 103 (also defined in lower surface 110) and purge well 105defined in mask 100, upper surface 101 (not shown, see e.g., FIGS. 1,5). As illustrated, the at least one orifice 511 in lower surface 510 ofprint head 500, is aligned with cleaning window 103, allowing print head500 to be cleaned using any wiping implement and easy access.

Turning now to FIG. 5, illustrating a X-Z cross section of the systemillustrated in FIG. 4. As illustrated, mask 100 in system 10 can betranslated in a first direction, causing printing slit 104 defined inlower surface 110 and disposed in between cleaning window 103 (alsodefined in lower surface 110) and purge well 105 defined in mask 100,upper surface 101 (not shown, see e.g., FIGS. 1, 5) to shift in theopposite direction, aligning cleaning window 103 with the at least oneorifice 511 in lower surface 510 of print head 500 (see e.g., FIG. 5),allowing print head 500 to be cleaned using any wiping implement 900(e.g., sponge, wiper, whether automated or manual) and easy access.

Turning now to FIG. 6, illustrating a X-Z cross section of the system 10in a purge cycle of cleaning whereby the purged ink is jetted throughthe printing slit, directly to the printed surface. As illustrated, mask100 in system 10 can be maintained in place, causing printing slit 104defined in lower surface 110 and disposed in between cleaning window 103(also defined in lower surface 110) and purge well 105 defined in mask100, upper surface 101 keeping printing slit 104 aligned with the atleast one orifice 511 in lower surface 510 of print head 500 (see e.g.,FIG. 2), allowing print head's 500 ink 550 to be purged through printslit 104, directly onto the printed surface. In this position, mask 100can still protect the at least one orifice 511 in lower surface 510 ofprint head 500 from heat or fumes generated by the printed surface.

Turning now to FIG. 7, illustrating a X-Z cross section of the system 10in a purge cycle of cleaning. As illustrated, mask 100 in system 10 canbe translated in a second direction, causing printing slit 104 definedin lower surface 110 and disposed in between cleaning window 103 (alsodefined in lower surface 110) and purge well 105 defined in mask 100,upper surface 101 to shift in the opposite direction, aligning purgewell 105 with the at least one orifice 511 in lower surface 510 of printhead 500 (see e.g., FIG. 2), allowing print head 500 to be purged intopurge well 105. Suction tube 700 can be either static (fixed in place)or mobile (selectably maneuvered) and be positioned in fluidcommunication with purge well 105. Ink 550 may also have sediment buildup. Suction tube 700 can convey ink 550 to a recycling sub-system, whichcan return the ink to print head 500 reservoir (not shown).

Turning now to FIG. 8 where mask plate 100, shown with printing slit 104defined in lower surface 110 and disposed in between cleaning window 103(also defined in lower surface 110) and purge well 105 defined in mask100, upper surface 101 can be operably coupled to driver 800 Driver 800can be, for example, a servo motor or any suitable driver, such as anelectric motor, a pneumatic motor and/or any other suitable electrical,mechanical, magnetic or other motor or driver that can apply a torqueforce upon shaft and selectably cause mask 100 to translate along anaxis relative to the print head(s). Driver 800 can be coupled to themask plate via rail(s) 120 coupled to mask plate 100 and disposed alongthe edges of mask plate 100. FIG. 7 also illustrates jacketing systemhaving cooling/heating fluid/gas 150 entering through inlet port 151 andexiting through outlet port 152. Cooling/heating fluid/gas 150 can be incommunication with a circulation means, for example, a positivedisplacement pump, diaphragm pump, centrifugal pump, reciprocating(e.g., simplex, duplex, triplex pumps), peristaltic pump or any otherpump capable of circulating fluid or gas at predetermined andcontrollable velocities in response to command received for example,from a processor.

While in the foregoing specification the systems and methods allowingCIP of print heads by selectably alternating the position of a maskbetween printing, cleaning and purging positions have been described inrelation to certain preferred embodiments, and many details are setforth for purpose of illustration, it will be apparent to those skilledin the art that the disclosure of the systems and methods allowing CIPof print heads by selectably alternating the position of a mask betweenprinting, cleaning and purging positions is susceptible to additionalembodiments and that certain of the details described in thisspecification and as are more fully delineated in the following claimscan be varied considerably without departing from the basic principlesof this disclosure.

What is claimed:
 1. A cleaning-in-place system for inkjet printing headscomprising: a. a mask having an upper surface and a lower surface, themask defining: i. a cleaning window; ii. a printing slit; and iii. apurge well recessed into the upper surface of the mask; b. a print headhaving a distal end, a proximal end, a longitudinal axis, and atransverse axis, the distal end having lower surface defining at leastone orifice; c. a three (3) dimension alignment assembly, operablycoupled to the print head and the mask; and d. a bracket, operablycoupled to the alignment assembly, wherein the mask is configured toselectably align the cleaning window, the printing slit, or the purgewell with the printing head's at least one orifice.
 2. The system ofclaim 1, wherein the mask is jacketed.
 3. The system of claim 2, whereinthe jacketed mask is air or liquid jacketed.
 4. The system of claim 3,further comprising a driver operably coupled to the mask.
 5. The systemof claim 4, wherein the system further comprises a suction tube operablycoupled to the mask, the suction tube being in fluid communication withthe purge well and a vacuum source.
 6. The system of claim 5, whereinthe three dimension alignment assembly comprises: a. a base frame; b. aside-to-side (STS) aligning frame, operably coupled to the base frame;and c. a front-to back (FTB) aligning frame, operably coupled to theside-to-side aligning frame.
 7. The system of claim 6, wherein the printhead further comprises an alignment tab, configured to modulate roll ofthe print head relative to the transverse axis, the alignment taboperably coupled to the front-to-back aligning frame.
 8. The system ofclaim 7, wherein the driver is operably coupled to the mask via at leasta pair of rails.
 9. The system of claim 5, wherein the suction tube isin further communication with an ink reservoir, the ink reservoir beingin fluid communication with the print head.
 10. The system of claim 1,wherein the printing slit is disposed between the cleaning window andthe purge well.
 11. A method of cleaning-in-place an inkjet print head,comprising: a. providing a clean-in-place system comprising: i. a maskhaving an upper surface and a lower surface, the mask defining aprinting slit disposed between a cleaning window and a purge wellrecessed into the upper surface of the mask; ii. a print head having adistal end, a proximal end, a longitudinal axis, and a transverse axisthe distal end having lower surface defining at least one orifice; andiii. a bracket, operably coupled to an alignment assembly; b. selectablyaligning the cleaning window or the purge well with the printing head'sat least one orifice; c. cleaning or purging the printing head's oneorifice; and d. aligning the at least one orifice with the printingslit.
 12. The method of claim 11, wherein the system further comprises asuction tube operably coupled to the mask, the suction tube being influid communication with the purge well and a vacuum source.
 13. Themethod of claim 12, comprising: a. aligning the printing head's at leastone orifice with the purge well; b. purging a content of the printinghead through the at least one orifice into the purge well; and c. usingthe vacuum source, suctioning the content of the purge well.
 14. Themethod of claim 13, wherein the suction tube is in fluid communicationwith a reservoir operably coupled to the print head, the method furthercomprising the step of recycling the suctioned content back to thereservoir.
 15. The method of claim 14, further comprising a step ofmodulating the temperature of the mask using air or liquid.
 16. Themethod of claim 11, wherein the mask is jacketed.
 17. The method ofclaim 11, wherein the system further comprising a driver operablycoupled to the mask, configured to selectably align the print head's atleast one orifice with the printing slit, the cleaning window, or thepurge well.
 18. The method of claim 17, wherein the driver is incommunication with a processor coupled to a memory module having thereona computer-readable medium with a set of executable instructionconfigured for automatically selectably aligning the print head's atleast one orifice with the printing slit, the cleaning window, or thepurge well.
 19. The method of claim 18, wherein automatically selectablyaligning the print head's at least one orifice with the printing slit,the cleaning window, or the purge well is in response to data obtainedfrom a sensor.
 20. The method of claim 19, wherein the sensor is atemperature sensor, visual sensor, flow sensor, viscosity sensor,conductivity sensor or a sensor array comprising one or more of theforegoing.